• Gross Leak and T.S. Fluids
• Thermal Schock
• Lead Free and Vapor Phase Soldering

Local Solvay Distribution Representatives
and Product Info

• Wafer / Die Probers
• Probe & Inspection Systems
• Flexible configuration platform
• Manual, Semi-Auto & Auto solutions

• Molecular Vapor Deposition
• Organic Coatings
• Metal Oxides Coatings
• Alternative to CVD & ALD

• Advanced Metal Based PWB's for:
Automotive, LED Lighting, Intelligent Power Modules, Inverter Circuits, Converters

• Representing Disco In Ut & Id
• Wafer Grinding
• Saw Singulation
• Laser Singulation
• Dicing System and Blades

• Manufacturers of Precision Molds & Dies
• Specializing in Encapsulation & Insert Molding
• Presses
• Hanmi Systems
• Renesas Systems
• Molds & Pre-heaters
• Deflashing & Airblasting

• Manual Wire Bonding Machines
• Workholders & Accessories

• Laser Marking
• Inspection Systems
• Customized Automation Solutions

• Singulation Systems
• Automated Mold Systems
• Pick & Place Systems
• Ball Mounting Systems
• Trim and Form Singulation
• Tape Handlers
• Test Handlers
• Laser marking

• Semiconductor Inspection
• SystemsFactory Automation Systems
• Automated Test Handling

• Semiconductor Inspection Equipment
• Wafer Surface Analyzer
• Chip Defect Inspection

• Board Level IC Test Handlers
• Specialized Logic IC Test Handlers
• Flash Card Test Handler

• Bond Testers:
Wire Pull / Bond Shear / Die Shear

• Die Sorters: Semi & Automated

• Gross/Fine Leak Preconditioning Systems
• Centrifuge Systems & Inserts
• Bubble Detectors
• Ambient/Hot Test Handlers
• Burn-in Board Loaders/Unloaders

• Etched & Stamp Leadframes
• QFN ND BCC
• Tape: BGA, Tape:CSP

• Ceramic Substrates
• Organic Substrates
• RF Power Device PKGS
• Opticle Packages
• Led Packages
• DBC Substrates

• Gold Wire for Semiconductor Package Assembly
• High and Low Loop Applications
• Hybrid Wires for Low Cost

• 6”-12” WAFER FRAMES
• WAFER/LF CASSETTES
• UV CURING SYSTEMS

• Carrier Tape
• Cover Tape
• SMD Reels
• Barrier Bags, Humidity Cards, Dessicants

• Plating/Sputtering/Vapor deposition
• Assembling/Bonding
• Glass Wafer Technology

• HB-LED Testing Systems
• High Speed Optical Test
• Die Optical Inspection

• Glass-to-Metal Technology
• Hermetically Sealed Packages & Sockets

*November 2010
SSI Exhibits at the BajaMak 2010 Industrial Expo in Tijuana Mexico.  The Expo included local manufacturing companies from the aerospace, metalmechanical, medical devices, electronics and automotive industries.  Sales & Service Inc. is dedicated in expanding supplier-business relationships to support the expanding manufacturing demands in Mexico.

*June 2009
SSI takes over North American distribution of Galden electronic test fluids for Solvay Solexis, and begins sending first direct shipments.