• Die Distribution
• Value Added Processing
• Form Factor Reduction
• CM Packaging

• MVD 100 SYSTEM
• MVD 150 SYSTEM

• Advanced Metal Based PWB's for:
Automotive, LED Lighting, Intelligent Power Modules, Inverter Circuits, Converters

• Prototype and Engineering Development
• Transfer High Volume Production Off-Shore
• New Product Introduction Management
• Substrates: Flex Circuits, PCBs; Ceramics
• High Component Density
• Small SMD and fine pitch
  • 0201 and larger
  • MicroBGA; CSP packages; TQFP; TSOIP
• Direct Die Attach
  • Chip-On-Flex
  • Flip Chip On Flex
• Integrate Flex for complete substrate interconnect solution
• Very Precise Component Placement

• Solar SmartPole™ Lighting Systems
• LED Lighting Technology
• Low Energy Retrofit Solutions

• Mixed Signal-Analog ASIC
• Design / Fab / Test / Packaging
• Prototype & Production

• Gross Leak and T.S. Fluids
• Liquid Burn-in
• Vaapor Phase Reflow Fluids
• Test & Heat Transfer Fluids

• Representing Disco In Ut & Id
• Automated Backgrind Systems
• Semi & Fully Automated Dicing Systems
• Dicing Blades
• Backgrinding Wheels and Tape

• Manufacturers of Precision Molds & Dies
• Specializing in Encapsulation & Insert Molding
• Presses
• Hanmi Systems
• Renesas Systems
• Molds & Pre-heaters
• Deflashing & Airblasting

• Wafer Sorter
• Wafer Chuck
• SiP Bonder
• SiP Mounter
• High Sensitivity Gas Analyzer

• Wafer Sorter
• Wafer Chuck
• SiP Bonder
• SiP Mounter
• High Sensitivity Gas Analyzer

• Singulation Systems
• Automated Mold Systems
• Pick & Place Systems
• Ball Mounting Systems
• Trim and Form Singulation
• Tape Handlers
• Test Handlers
• Laser marking

• Semiconductor Inspection
• SystemsFactory Automation Systems
• Automated Test Handling

• Semiconductor Inspection Equipment
• Wafer Surface Analyzer
• Chip Defect Inspection

• Board Level IC Test Handlers
• Specialized Logic IC Test Handlers
• Flash Card Test Handler

• Bond Testers:
Wire Pull / Bond Shear / Die Shear

• Die Sorters: Semi & Automated

• Gross/Fine Leak Preconditioning Systems
• Centrifuge Systems & Inserts
• Bubble Detectors
• Ambient/Hot Test Handlers
• Burn-in Board Loaders/Unloaders

• Etched & Stamp Leadframes
• QFN ND BCC
• Tape: BGA, Tape:CSP

• Ceramic Substrates
• Organic Substrates
• RF Power Device PKGS
• Opticle Packages
• Led Packages
• DBC Substrates

• Gold Wire for Semiconductor Package Assembly
• High and Low Loop Applications
• Hybrid Wires for Low Cost

• 6”-12” WAFER FRAMES
• WAFER/LF CASSETTES
• UV CURING SYSTEMS

• Sockets - Test/Burn-In
• Machine and Molded
• Standard and Custom
• Various Contact Solutions
• 0.5mm Pitch Capable

• Kiru/Kezuru/Migaku
• Plating/Sputtering/Vapor deposition
• Assembling/Bonding
• Cu/CuW/Kv/Ag/Mo etc.
• Si/Al2O3/AlN/Sapphire etc.
• Glass (Brofloat33, SD2, SW-YY etc.)

• Carrier Tape
• Cover Tape
• SMD Reels
• Barrier Bags, Humidity Cards, Dessicants

*February 2010
West LA College completes first phase of solar Smartpole™ installations on campus

*July 2009
SSI and Inovus Solar deliver first high volume shipments of solar pole systems.

*June 2009
SSI takes over North American distribution of Galden electronic test fluids for Solvay Solexis, and begins sending first direct shipments.

*January 2009
SSI signs to become the sales and marketing agent for AMST throughout the U.S.