Contract Assembly Services

Manufacturers

                		
DISCO HI-TEC AMERICA, INC.

Global Leader in the design and manufacture of advanced abrasive tools and precision machines for the semiconductor and electronics industries offering Singulation and Thinning solutions through the following products:

*Blade Dicing

*Laser Dicing

*Wafer Thinning / Backgrinding

*Stress Relief

*Dice Before Grind

DISCO HI-TEC AMERICA, INC.
Products
» Lab Services for Wafer Thinning/Backgrinding, Saw Dicing, Stealth and Ablation Laser Dicing

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