Contract Assembly Services

Manufacturers

                		
DISCO HI-TEC AMERICA, INC.

Global Leader in the design and manufacture of advanced abrasive tools and precision machines for the semiconductor and electronics industries offering Singulation and Thinning solutions through the following products:

*Blade Dicing

*Laser Dicing

*Wafer Thinning / Backgrinding

*Stress Relief

*Dice Before Grind

DISCO HI-TEC AMERICA, INC.
Products
» Lab Services for Wafer Thinning/Backgrinding, Saw Dicing, Stealth and Ablation Laser Dicing

                		
IMI

This is the start of a new partnership.

At Integrated Micro-Electronics Inc. (IMI), we are deeply committed to delivering innovative electronics manufacturing services (EMS) and power semiconductor assembly and test services (SATS) for diversified markets that include those in the automotive, industrial, medical, solar energy, telecommunications infrastructure, storage device, and consumer electronics industries.

IMI
Products
» Contract Electronic Manufacturing Services including Power Electronics Semiconductor Assembly & Test Services

                		
KEACO

 

Keaco is a global leader in high quality tape and reel packaging products for the electronics, manufacturing and medical industries. Keaco is your true one stop single source supplier. Keaco offers a complete line of quality products with unbeatable pricing and the best in customer service. These unmatched services include technical and design assistance from their in house experts with over forty years of combined industry experience. Keaco’s products include:

 

*Carrier Tapes

*Cover Tapes

*SMD Reels

*Barrier Bags

*Humidity Indicator Cards

*Desiccants

*Related Items

 

KEACO
Products
» Tape & Reel Contract Packaging Services

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