Contract Assembly Services
DISCO HI-TEC AMERICA, INC.
Global Leader in the design and manufacture of advanced abrasive tools and precision machines for the semiconductor and electronics industries offering Singulation and Thinning solutions through the following products:
*Wafer Thinning / Backgrinding
*Dice Before Grind
» Lab Services for Wafer Thinning/Backgrinding, Saw Dicing, Stealth and Ablation Laser Dicing